Apparatus for packaging a tape substrate

ABSTRACT

An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program stored therein, and a control module coupled to the memory to execute the program to perform a packaging process. The packaging process includes clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment, and securing a second segment of the tape substrate adjacent the first segment to a second clamping element. The packing process also includes moving the robotic arms relative to one another to stack the second segment over the first capsule. The first clamping element and second clamping element move independently of each other.

This is a Divisional Application of U.S. patent application Ser. No.10/228,617, filed Aug. 26, 2002, which is presently pending.

FIELD

Embodiments of the present invention relate, in general, to devicemanufacturing and packaging and, more particularly, to the packaging ofa device with multiple units formed on a tape substrate.

BACKGROUND

Device packaging is an important part of semiconductor devicemanufacturing processes. A process for packaging multiple device diesinto a single device package includes bonding the device dies on a tapesubstrate and packaging the dies and the tape substrate into a singledevice. One such packaging process includes folding the tape substrateto stack the multiple device dies bonded thereon together. The adhesivesdispensed between the dies in the stack are cured, thereby holding thedies in the stack together.

An apparatus used for such a tape substrate packaging process typicallyhas mechanical fingers and pusher to handle the dies and the tapesubstrate. Specifically, the mechanical fingers and pushers stack thedies together. Another apparatus design may include a hinged assembly tofold the tape substrate. Currently, the adhesive dispensing is generallyperformed manually or by equipment separate from the device packagingapparatus.

The mechanical fingers and pusher, or hinged assembly in an existingpackaging apparatus are generally deficient in ensuring accuratepositions of the dies and tape substrate during the packaging process.In addition, the apparatus generally does not integrate adhesivedispensing and curing into the device packaging process. The apparatusis not easily modifiable for packaging different devices. The tapesubstrate device packaging processes using the existing apparatuses aregenerally time consuming.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and form a part ofthis specification, illustrate embodiments of the present invention and,together with the description, serve to explain the principles of thepresent invention:

FIG. 1 illustrates one embodiment of a device to be packaged inaccordance with the present invention;

FIG. 2 is a functional block diagram illustrating one embodiment of anapparatus for performing a packaging process in accordance with thepresent invention;

FIGS. 3A-3D illustrates one embodiment of a device packaging process inaccordance with an aspect of the present invention;

FIG. 4 illustrates one embodiment of a semiconductor device after beingpackaged in accordance with the present invention;

FIG. 5 illustrates an alternative embodiment of another semiconductordevice after being packaged in accordance with the present invention;

FIGS. 6A-6H illustrates one embodiment of a device packaging process inaccordance with another aspect of the present invention; and

FIGS. 7A-7B illustrates one embodiment of a device packaging process inaccordance with yet another aspect of the present invention.

DETAILED DESCRIPTION

Reference will now be made to the several embodiments of the invention,examples of which are illustrated in the accompanying drawings. Whilethe present invention will be described in conjunction with thedifferent embodiments, it will be understood that they are not intendedto limit the invention to these embodiments. On the contrary, thepresent invention is intended to cover alternatives, modifications andequivalents, which may be included within the spirit and scope of theinvention as defined by the claims. Moreover, in the following detaileddescription of the present invention, numerous specific details are setforth in order to provide a thorough understanding of the presentinvention. However, the present invention may be practiced without thesespecific details. In other instances, well-known methods, procedures,components and circuits have not been described in detail as not tounnecessarily obscure aspects of the present invention.

FIG. 1 illustrates a device 100 to be packaged in accordance with thepresent invention. By way of example, device 100 is a semiconductordevice that includes a plurality of device dies or chips encapsulated ona tape substrate 12. FIG. 1 shows five device units formed on a frontside 14 of tape substrate 12, each unit may include one or more diesencapsulated therein. Specifically, device 100 includes device units 21,22, 23, 24, and 25, which are also referred to as capsules, formed insections 31, 32, 33, 34, and 35, respectively, of tape substrate 12. Thesections in tape substrate 12 are also referred to as segments.

The minimum distance between two adjacent device units on tape substrate12 depends on the thickness and flexibility of tape substrate 12 as wellas the thickness of the device units. By way of example, FIG. 1 showsthat the distance between device units 23 and 24 is greater than thosebetween device units 21 and 22 and between device units 24 and 25, butless than that between device units 21 and 23. This specific distancearrangement is used for packaging, in which device units 21-25 arestacked together in a specific order described herein after withreference to FIGS. 6A-6H. When the order in which device units 21-25 arestacked together changes, the arrangement of the minimum distancesbetween adjacent device units also change accordingly. Alternatively,the distances between adjacent device units are uniform throughout tapesubstrate 12 at a value sufficient for stacking device units 21-25 invarious orders.

In one example, each of device units 21-25 has a thickness ofapproximately 0.2 millimeter (mm) and tape substrate 12 is about 0.1 mmthick. In such an example, the minimum distance between device units 21and 22 and between device units 24 and 25 is approximately 0.9 mm. Theminimum distance between device unit 23 and 24 is approximately 1.5 mm,and the minimum distance between device units 21 and 23 is approximately2.1 mm.

The electronics circuits in device units 21-25 communicate with eachother through conductive paths formed in tape substrate 12 between frontside 14 and a back side 16. Ball grid arrays (not shown) may be formedon back side 16, thereby enabling the communication between device 100with other devices and circuits. The location of the ball grid arraysdepends on the order in which device units 21-25 are stacked together.In accordance with one embodiment, one ball grid array is formed on backside 16 of tape substrate 12 in section 31. In another embodiment, twoball arrays are formed on back side 16 of tape substrate 12, one insection 31 and another in section 33.

Encapsulating dies on tape substrate 12 to form device units 21-25 mayinclude such procedures as molding, encapsulating, and sealing, whichare known in the art. Prior to encapsulation, molding, or sealing, otherprocesses such as, for example, wire bonding, lead bonding, bumpbonding, and die stacking may be performed upon device units 21-25 priorto encapsulation. After encapsulation, molding, or sealing, device units21-25 may be subject to additional processes such as ball attaching,marking, etc.

It should be noted that, in accordance with an embodiment of the presentinvention, device units 21-25 are not limited to being formed usingthose procedures described herein above. It should also be noted thatdevice 100 is not limited to having five device units formed thereon. Inaccordance with the present invention, device 100 may include any numberof device units formed on tape substrate 12. Furthermore, device 100 isnot limited to having device units formed on front side 14 of tapesubstrate 12. A device packaging apparatus and a packaging process inaccordance with the present invention are also capable of packaging adevice with device units formed on both front side 14 and back side 16of tape substrate 12.

FIG. 2 is a diagram illustrating one embodiment of a device packagingapparatus 200 for performing a multiple chip packaging process inaccordance with the present invention. Apparatus 200 includes aplurality of robotic arms 51 and 52. A plurality of clamping elements 61and 62 are attached to respective robotic arms 51 and 52. In oneembodiment, clamping elements 61 and 62 include vacuum chucks. Apparatus200 further includes an adhesive applicator 67. In one embodiment,adhesive applicator 67 applies an adhesive tape or film during thepackaging process. In another embodiment, adhesive applicator 67 appliesa fluid adhesive, e.g., epoxy. A control module 68 is coupled to roboticarms 51 and 52, clamping elements 61 and 62, and adhesive applicator 67.By way of example, control module 68 includes a microprocessor (MP) or acentral processing unit (CPU). Control module 68 is also coupled to amemory 69, which stores program routines for the operation of apparatus200.

Although FIG. 2 shows apparatus 200 as having two robotic arms 51 and52, two clamping elements 61 and 62, and one adhesive applicator 67,this is not intended as a limitation on the scope of the presentinvention. Depending on the characters of the devices to be packaged,apparatus 200 may include any plural number of robotic arms and clampingelements. Apparatus 200 may also include more than one adhesiveapplicator. In an alternative embodiment, apparatus 200 includes severaladhesive applicators for applying different types of adhesives.Furthermore, apparatus 200 may include other elements not shown in FIG.2. In one embodiment, apparatus 200 includes a heating element. Inanother embodiment apparatus 200 includes a cooling element. In yetanother embodiment, apparatus 200 includes a source of electromagneticradiation, e.g., infrared radiation, microwave radiation, etc. Apparatus200 may also include a combination of the above mentioned elements.Different variations of the packaging process in accordance withalternative embodiments of the present invention determine what elementsthat apparatus 200 includes.

In operation, control module 68 executes the program routines stored inmemory 69 and controls robotic arms 51 and 52, clamping elements 61 and62, and adhesive applicator 67 to package a multiple die device such asdevice 100 shown in FIG. 1. The mechanism for operating robotic arms 51and 52, clamping elements 61 and 62, and adhesive applicator 67 mayinclude robotic, electromechanical, electromagnetic, pneumatic,hydraulic, etc. In one embodiment, robotic arms 51 and 52 can move androtate independently of each other, thereby enabling apparatus 200 toprecisely package devices of various characters.

Apparatus 200 is capable of packaging multiple die devices of variouscharacters. By executing the program routines stored in memory 69,control module 68 instructs robotic arms 51-55, clamping elements 61-65,and adhesive applicator 67 to perform the packaging process. The programroutines can be modified to accommodate devices of different characters,which include tape substrate thickness and flexibility, device unitthickness and dimension, the number and locations of the device units onthe tape substrate, etc. The program routines can also be modified toapply different adhesives and use different elements to cure theadhesives.

FIGS. 3A-3D illustrates a device packaging process in accordance with anembodiment of the present invention. The process uses a device packagingapparatus like apparatus 200 shown in FIG. 2 to package a device 100having two device units 21 and 22 formed on front side 14 of tapesubstrate 12. Specifically, device units 21 and 22 are formed insegments 31 and 32, respectively, of tape substrate 12.

As shown in FIG. 3A, segments 31 and 32 of tape substrate 12 are securedto clamping elements 61 and 62, respectively, of apparatus 200. In oneembodiment, clamping elements 61 and 62 are vacuum chucks. Device 100 issecured to clamping elements 61 and 62 by placing back side 16 of tapesubstrate 12 in segments 31 and 32 over the vacuum chucks and turning onvacuum chucks 61 and 62.

In a next step, as shown in FIG. 3B, an adhesive 101 is applied ondevice unit 21 using adhesive applicator 67 of FIG. 2. Adhesive 101 canbe a paste or fluid adhesive such as epoxy; it can also be an adhesivetape or film. It should be noted that adhesive 101 is not limited tobeing applied on device unit 21. In accordance with an embodiment of thepresent invention, adhesive can be applied on device unit 21, deviceunit 22, or both. Further, adhesive 101 is not limited to being appliedto completely cover the whole top surface of device unit 21.

In FIG. 3C, clamping element 61 moves in a first direction towardclamping element 62 as indicated by an arrow 81. Clamping element 62moves in a second direction, as indicated by an arrow 82, substantiallyperpendicular to first direction 81. In addition, clamping element 62rotates in a direction indicated by an arrow 92 to bend or fold tapesubstrate 12. In accordance with an embodiment of the present invention,clamping element 62 rotates over an angle of approximately 180 degrees(°) to place device unit 22 substantially facing device unit 21. Itshould be noted that the motion of clamping element 61 in firstdirection 81 toward clamping element 62 is optional in a packagingprocess in accordance with the present invention. In an alternativeembodiment, clamping element 61 does not move, and clamping element 62rotates and moves toward clamping element 61, thereby avoiding overstretching tape substrate 12.

In FIG. 3D, clamping element 62 moves in a third direction, as indicatedby an arrow 83, substantially perpendicular to second direction 82 shownin FIG. 3C to place device unit 22 in substantial contact with deviceunit 21. In one embodiment, device unit 22 is in good contact withadhesive 101 applied on device unit 21. This can be achieved by applyinga force on device 100 through clamping elements 61 and 62 to pressdevice units 21 and 22 against each other.

After clamping elements 61 and 62 stack device units 21 and 22 togetheras described above, adhesive 101 is cured. Curing adhesive 101 may be assimple as holding device units 21 and 22 in place by clamping elements61 and 62 for a period long enough for adhesive 101 to be cured. Thecuring period generally depends on the characteristics of adhesive 101and curing conditions. The curing condition may be changed up byaltering the environment surrounding device 100. For example, the curingcondition can be changed by taking such actions as heating device units21 and 22, cooling device units 21 and 22, irradiating device units 21and 22 with an electromagnetic radiation, e.g., infrared radiation,microwave radiation, etc., or any combination thereof. What actualactions to take depends on the characteristics of adhesive 101.

After curing adhesive 101, clamping elements 61 and 62 are detached orreleased from respective segments 31 and 32 of tape substrate 12. Thepackaging is completed.

FIG. 4 shows a semiconductor device 100 after being packaged inaccordance with an embodiment of the present invention. Device 400 shownin FIG. 4 has three capsules or device units formed on front side 14 oftape substrate 12. The packaging of device 100 shown in FIG. 4 issimilar to that described herein above with reference to FIGS. 3A-3D.

First, sections 31, 32, and 33, on which respective device units 21, 22,and 23 are formed, are secured to three clamping elements, e.g.,clamping elements 61, 62, and 63 of apparatus 200 shown in FIG. 2.Adhesive 101 is applied on device unit 21, device unit 22, or both. Theclamping element which secures section 32 of tape substrate 12 rotatesand moves to place device unit 22 facing and in substantial contact withdevice unit 21. The clamping element is then released from section 32 oftape substrate 12. In one embodiment, the adhesive 101 is cured beforereleasing the clamping element from section 32 of tape substrate 12.

In a subsequent step, an adhesive 102 is applied on device unit 23, backside 16 of tape substrate 12 in section 32, or both. Adhesive 102 can beof the same type as or different from adhesive 101. The clamping elementsecuring section 33 of tape substrate 12 moves and rotates forapproximately 180° to place device unit 23 facing and in contact withsection 32 of tape substrate 12. In one embodiment, adhesive 102 iscured before releasing the clamping elements from sections 31 and 33 oftape substrate 12.

Depending on their properties, the curing of adhesives 101 and 102 mayinclude heating device, cooling device, irradiating device with aradiation, or any combination thereof. Adhesives 101 and 102 may becured at different times or all at once after device units 21, 22, and23 are stacked together.

FIG. 5 shows another device 100 after being packaged in accordance withan embodiment of the present invention. Device 500 shown in FIG. 5 hasfour capsules or device units formed on front side 14 of tape substrate12. FIG. 4 shows that section 32 is on one side of section 31 andsection 33 is on the other side of section 31 of tape substrate 12.Further, section 34 is adjacent section 33 and on the opposite side ofsection 33 from section 31. The packaging of device 100 shown in FIG. 5is similar to those described herein above with reference to FIGS. 3A-3Dand FIG. 4.

First, sections 31, 32, 33, and 34, on which respective device units 21,22, 23, and 24 are formed, are secured to three clamping elements, e.g.,clamping elements 61, 62, 63, and 64 of apparatus 200 shown in FIG. 2.An adhesive 101 is applied on at least one of device unit 21 and deviceunit 22. The clamping element securing section 32 of tape substrate 12rotates and moves to place device unit 22 facing and in substantialcontact with device unit 21. An adhesive 102 is applied on at least oneof device unit 23 and device unit 24. The clamping element securingsection 34 of tape substrate 12 rotates and moves to place device unit24 facing and in substantial contact with device unit 23. The clampingelements are then released from sections 32 and 34 of tape substrate 12.In one embodiment, the adhesives 101 and 102 may be cured beforereleasing the clamping elements from sections 32 and 34 of tapesubstrate 12.

An adhesive 103 is applied on back side 16 of tape substrate 12 in atleast one of sections 32 and 34. The clamping element securing section33 of tape substrate 12 moves and rotates for approximately 180° toplace section 34 facing and in contact with section 32 of tape substrate12. In one embodiment, the adhesive 103 is cured before releasing theclamping elements from sections 31 and 33 of tape substrate 12.

Depending on their properties, the curing of adhesives 101, 102, and 103may include heating device, cooling device, irradiating device with anelectromagnetic radiation, or any combination thereof. Adhesives 101,102, and 103 may be cured at different times or all at once after deviceunits 21, 22, 23, and 24 are stacked together.

FIGS. 6A-6H illustrate a device packaging process in accordance withanother embodiment of the present invention. The process uses a devicepackaging apparatus like apparatus 200 shown in FIG. 2 to packaging adevice 100 having five device units 21, 22, 23, 24, and 25 formed onfront side 14 of tape substrate 12. Specifically, device units 21, 22,23, 24, and 25 are formed in segments 31, 32, 33, 34, and 35,respectively, of tape substrate 12. FIG. 6A shows that segment 32 is onone side of segment 31 and segments 33, 34, and 35 are on the other sideof segment 31. Furthermore, segment 33 is located between segments 31and 34, and segment 34 is located between segments 33 and 35. Thepacking of device 100 with device units 21-25 is similar to thosedescribed herein above with reference to FIGS. 3A-3D, FIG. 4, and FIG.5.

As shown in FIG. 6A, segments 31, 32, 33, 34, and 35 of tape substrate12 are secured to clamping elements 61, 62, 63, 64, and 65,respectively, of apparatus 200. In one embodiment, clamping elements61-65 are vacuum chucks. Device 100 is secured to clamping elements61-65 by placing back side 16 of tape substrate 12 in segments 31-35 onthe vacuum chucks and turning on vacuum chucks 61-65. An adhesive 101 isapplied on device unit 21, device unit 22, or both. An adhesive 102 isapplied on at least one of device unit 24 and device unit 25.

In a subsequent step, clamping elements 61, 63, 64, and 65 move in afirst direction toward clamping element 62 as indicated by an arrow 81in FIG. 6B. Clamping element 62 moves in a second direction, asindicated by an arrow 82 in FIG. 6B, substantially perpendicular tofirst direction 81. In addition, clamping element 62 rotates in adirection indicated by an arrow 92 in FIG. 6B for approximately 180° tobend or fold tape substrate 12 and to place device unit 22 substantiallyfacing device unit 21.

In FIG. 6C, clamping element 62 moves in a third direction, as indicatedby an arrow 83, substantially opposite to second direction 82 shown inFIG. 6B to place device unit 22 in substantial contact with device unit21. Device unit 22 is in good contact with adhesive 101 applied ondevice unit 21. This can be achieved by asserting a force on device 100through clamping elements 61 and 62 to press device units 21 and 22against each other. After clamping elements 61 and 62 stack device units21 and 22 together, adhesive 101 is cured. Curing adhesive 101 mayinclude any procedures describe herein above with reference to FIGS.3A-3D. After curing adhesive 101, clamping element 62 is released fromback side 16 of tape substrate 12.

Clamping elements 61, 63, and 64 move in a fourth direction towardclamping element 65 as indicated by an arrow 84 in FIG. 6D. Clampingelement 65 moves in second direction 82 and rotates in a directionindicated by an arrow 94 in FIG. 6D for approximately 180° to bend orfold tape substrate 12 and to place device unit 25 substantially facingdevice unit 24.

In FIG. 6E, clamping element 65 moves in third direction 83 to placedevice unit 25 in substantial contact with device unit 24. Adhesive 102is cured and clamping element 65 is subsequently released from back side16 of tape substrate 12.

Next as shown in FIG. 6F, an adhesive 103 is applied on at least one ofdevice unit 23 and back side 16 of tape substrate 12 in segment 35.Clamping elements 61 and 63 move in fourth direction 84 toward clampingelement 64. Clamping element 64 moves in second direction 82 and rotatesin direction 94 for approximately 180° to fold tape substrate 12 and toplace segment 35 of tape substrate 12 substantially facing device unit23.

In FIG. 6G, clamping element 64 moves in third direction 83 to placesegment 35 of tape substrate 12 in substantial contact with device unit23. Clamping element 64 is released from back side 16 of tape substrate12 after curing adhesive 103.

Next as shown in FIG. 6H, an adhesive 104 is applied on back side 16 oftape substrate 12 in at least one of segments 32 and 34. Clampingelements 61 moves in fourth direction 84 toward clamping element 63.Clamping element 63 moves in second direction 82 and rotates indirection 94 for approximately 180° to fold tape substrate 12 and toplace segment 34 of tape substrate 12 substantially facing segment 32 oftape substrate 12. Then, clamping element 63 moves in third direction 83to place segment 34 of tape substrate 12 in substantial contact withsegment 32 of tape substrate 12. Adhesive 104 is cured. Clampingelements 61 and 63 are subsequently released from back side 16 of tapesubstrate 12.

FIGS. 7A-7B illustrate a device packaging process in accordance with yetanother embodiment of the present invention. The process uses a devicepackaging apparatus like apparatus 200 shown in FIG. 2 to packaging adevice 100 having a single device unit 21 formed on front side 14 oftape substrate 12. Specifically, device unit 21 is formed in segment 31of tape substrate 12. There is no device unit formed in segment 32 oftape substrate 12, which is adjacent to segment 31 of tape substrate 12.

First, as shown in FIG. 7A, segments 31 and 32 of tape substrate 12 aresecured to clamping elements 61 and 62, respectively. An adhesive 101 isapplied on device unit 21. Adhesive 101 can be a paste or fluid adhesivesuch as epoxy; it can also be an adhesive tape or film. It should benoted that adhesive 101 is not limited to being applied on device unit21. In accordance with an embodiment of the present invention, adhesivecan be applied on device unit 21, front side 14 of tape substrate 12 insegment 32, or both.

Next, as shown in FIG. 7B, at least one of clamping elements 61 and 62moves and rotates to fold tape substrate 12 and stack segment 32 of tapesubstrate 12 over device unit 21. In one embodiment, front side 14 oftape substrate 12 in segment 32 is in good contact with adhesive 101applied on device unit 21. This can be achieved by applying a force ondevice 100 through clamping elements 61 and 62 to press segment 32 oftape substrate 12 against device units 21. Adhesive 101 is cured. Aftercuring adhesive 101, clamping elements 61 and 62 are detached orreleased from respective segments 31 and 32 of tape substrate 12.

The movements the clamping elements in first direction 81 and fourthdirection 84 as described herein above with reference to FIGS. 3A-3D and6A-6H avoid over stretching tape substrate 12. However, it should benoted that they are optional in accordance with the present invention.The over stretch of tape substrate 12 can also be avoided by moving theclamping element that is in rotation toward the rest of the clampingelements secured to the remaining segments of tape substrate 12.

It should be appreciated that an apparatus and a process for packaging adevice with multiple units have been provided. A packaging apparatus inaccordance with one embodiment of the present invention includes aplurality of robotic arms and a plurality of clamping elements attachedto the robotic arms for clamping different segments of the tapesubstrate and folding the tape substrate, thereby stacking the deviceunits together. In one embodiment of the present invention, thepackaging apparatus also includes an element for applying adhesives onthe device units and the tape substrate. Further, the packagingapparatus may include elements for facilitating the curing of theadhesive. When packaging a device with many device units on a tapesubstrate, in one embodiment, the two ends of the tape substrate onefolded toward the central portion of the tape substrate. In alternativeembodiments, the process may start from the central portion of the tapesubstrate. The packaging process and the apparatus of one embodiment ofthe present invention can be easily adapted for packaging devices withvarious characters and dimensions. The apparatus is capable ofintegrally performing different steps of the package process andhandling the device with high precision. The device packaging processand the apparatus are applicable in various areas of semiconductordevice manufacturing processes, such as, for example, chip scalepackaging, memory device packaging, communication device packaging, etc.

While specific embodiments of the present invention have been describedherein above, they are not intended as a limitation on the scope of thepresent invention. The present invention encompasses those modificationsand variations of the described embodiments that are obvious to thoseskilled in the art. For example, although the specification describesthe packaging processes for packaging devices with one, two, three,four, and five device units, these are not limitations on the presentinvention. The packaging process and apparatus of one embodiment of thepresent invention can package devices with any plural number of deviceunits formed on a tape substrate. Further, the packaging process andapparatus of one embodiment of the present invention can also packagedevices with device units formed on both sides of the tape substrate. Inaddition, the application of the packaging process in accordance withalternative embodiments of the present invention is not limited tosemiconductor device manufacturing. The packaging process and apparatusof alternative embodiments of the present invention can be used in anyarea that benefits from packaging at one or more units into a package.

1. A device packaging apparatus comprising: a plurality of robotic arms;a plurality of clamping elements attached to the robotic arms; a memoryhaving a program stored therein; and a control module coupled to thememory to execute the program to perform a packaging process comprising:clamping a plurality of segments of a tape substrate to the clampingelements, encapsulating a first chip to a first side of a tape substrateto form a first capsule in a first segment; securing a second segment ofthe tape substrate adjacent the first segment to a second clampingelement; and moving the robotic arms relative to one another to stackthe second segment over the first capsule, wherein the first clampingelement and second clamping element are moved independently of eachother.
 2. The device packaging apparatus of claim 1, wherein theclamping elements comprise vacuum chucks.
 3. The device packagingapparatus of claim 1, wherein each robotic arm moves independently withrespect to one another.
 4. The device packaging apparatus of claim 1further comprising at least one adhesive applicator to apply adhesivebetween the second segment and the first capsule.
 5. The devicepackaging apparatus of claim 4, wherein the adhesive applicatorcomprises an adhesive tape applicator.
 6. The device packaging apparatusof claim 4, wherein the adhesive applicator comprises a fluid adhesiveapplicator.
 7. A device packaging apparatus comprising: a first roboticarm and a second robotic arm; a first clamping element and a secondclamping element attached to the first and second robotic arms,respectively; a memory having a program stored therein; and a controlmodule coupled to the memory to execute the program to perform packagingoperations comprising: securing a first segment of a tape substrate to afirst clamping element; securing a second segment of the tape substrateadjacent the first segment to the second clamping element; automaticallymoving at least one of the first clamping element and the secondclamping element, relative to one another, in at least one directionwhile folding the tape substrate to stack the second segment over thefirst segment.
 8. The apparatus of claim 7, wherein moving at least oneof the first clamp element and the second clamping element comprises:moving the first clamping element horizontally in one direction; andsimultaneously folding the tape substrate to stack the second segment ofthe tape substrate over the first segment, maintaining an amount ofslack in the tape substrate while the tape substrate is folded.
 9. Theapparatus of claim 8, wherein folding the tape substrate comprises:rotating the second clamping element for approximately 180 degrees; andmoving the second clamping element to place the second segment of thetape substrate over the first segment.
 10. The apparatus of claim 7wherein: securing the first segment of the tape substrate includesplacing the second side of the tape substrate in the first segment overthe first clamping element; and securing the second segment of the tapesubstrate includes placing the second side of the tape substrate in thesecond segment over the second clamping element, wherein the first andsecond clamping elements each comprise a vacuum chuck.
 11. The apparatusof claim 7 further comprising: an adhesive applicator to apply a firstadhesive over at least one of the first segment and the second segmentof the tape substrate before moving at least one of the first segmentand the second segment to stack the second segment over the firstsegment.
 12. The apparatus of claim 11, further comprising: a heatingelement to heat the first adhesive.
 13. The apparatus of claim 11,further comprising: a source of electromagnetic radiation to irradiatethe first adhesive with an electromagnetic radiation.
 14. The apparatusof claim 1 further comprising: a cooling element to cool the firstadhesive.
 15. The apparatus of claim 7 further comprising: a thirdclamping element, the third clamping element moving independentlyrelative to the first and second clamping elements;
 16. The apparatus ofclaim 15, further comprising: a fourth clamping element, the fourthclamping element moving independently relative to the first, second, andthird clamping elements.